Integrated circuit with layered superlattice material compound

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257310, 257311, 257763, 257764, 257768, 365145, H01L 27108

Patent

active

057194165

ABSTRACT:
A method of fabricating a ferroelectric or layered superlattice DRAM compatible with conventional silicon CMOS technology. A MOSFET is formed on a silicon substrate. A thick layer of BPSG followed by a thin SOG layer overlies the MOSFET. A capacitor is formed by depositing a layer of platinum, annealing, depositing an intermediate layer comprising a ferroelectric or layer superlattice material, annealing, depositing a second layer of platinum, then patterning the capacitor. Another SOG layer is deposited, contact holes to the MOSFET and capacitor are partially opened, the SOG is annealed, the contact holes are completely opened, and a Pt/Ti/PtSi wiring layer is deposited.

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Dohler, G.H., "Solid-State Superlatticcs," Scientific American, Nov. 1983, pp. 144-151.

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