Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-10-18
2005-10-18
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S706000, C257S707000, C257S712000, C257S713000, C257S723000
Reexamination Certificate
active
06956284
ABSTRACT:
The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance. In an alternative embodiment, the form standard may include a heat spreader portion with mounting feet. In a preferred embodiment of the memory addressing system, a high speed switching system selects a data line associated with each level of a stacked module to reduce the loading effect upon data signals in memory access.
REFERENCES:
patent: 3436604 (1969-04-01), Hyltrin
patent: 3654394 (1972-04-01), Gordon
patent: 3746934 (1973-07-01), Stein
patent: 3772776 (1973-11-01), Weisenburger
patent: 4288841 (1981-09-01), Gogal
patent: 4513368 (1985-04-01), Houseman
patent: 4645944 (1987-02-01), Uya
patent: 4696525 (1987-09-01), Coller et al.
patent: 4733461 (1988-03-01), Nakano
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4833568 (1989-05-01), Berhold
patent: 4862249 (1989-08-01), Carlson
patent: 4891789 (1990-01-01), Quattrini et al.
patent: 4911643 (1990-03-01), Perry et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 4956694 (1990-09-01), Eide
patent: 4983533 (1991-01-01), Go
patent: 5041015 (1991-08-01), Travis
patent: 5099393 (1992-03-01), Bentlage et al.
patent: 5117282 (1992-05-01), Salatino
patent: 5138430 (1992-08-01), Gow, 3 rdet al.
patent: 5159434 (1992-10-01), Kohno et al.
patent: 5222014 (1993-06-01), Lin
patent: 5224023 (1993-06-01), Smith et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5241454 (1993-08-01), Ameen et al.
patent: 5247423 (1993-09-01), Lin et al.
patent: 5259770 (1993-11-01), Bates et al.
patent: 5261068 (1993-11-01), Gaskins et al.
patent: 5281852 (1994-01-01), Normington
patent: 5313097 (1994-05-01), Haj-Ali-Ahmadi et al.
patent: 5375041 (1994-12-01), McMahon
patent: 5428190 (1995-06-01), Stopperan
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5484959 (1996-01-01), Burns
patent: 5543664 (1996-08-01), Burns
patent: 5566051 (1996-10-01), Burns
patent: 5572065 (1996-11-01), Burns
patent: 5612570 (1997-03-01), Eide et al.
patent: 5642055 (1997-06-01), Difrancesco
patent: 5644161 (1997-07-01), Burns
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5778552 (1998-07-01), LeGuin
patent: 5801437 (1998-09-01), Burns
patent: 5805422 (1998-09-01), Otake et al.
patent: 5869353 (1999-02-01), Levy et al.
patent: 5917709 (1999-06-01), Johnson et al.
patent: 5926369 (1999-07-01), Ingraham et al.
patent: 5949657 (1999-09-01), Karabatsos
patent: 5953215 (1999-09-01), Karabatsos
patent: 6014316 (2000-01-01), Eide
patent: 6028365 (2000-02-01), Akram et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6172874 (2001-01-01), Bartilson
patent: 6205654 (2001-03-01), Burns
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6222737 (2001-04-01), Ross
patent: 6225688 (2001-05-01), Kim et al.
patent: 6233650 (2001-05-01), Johnson et al.
patent: 6262895 (2001-07-01), Forthurn
patent: 6265660 (2001-07-01), Tandy
patent: 6266252 (2001-07-01), Karabatsos
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6323060 (2001-11-01), Isaak
patent: 6351029 (2002-02-01), Isaak
patent: 6360433 (2002-03-01), Ross
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6376769 (2002-04-01), Chung
patent: 6392162 (2002-05-01), Karabatsos
patent: 6410857 (2002-06-01), Gonya
patent: 6426240 (2002-07-01), Isaak
patent: 6426549 (2002-07-01), Isaak
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6444921 (2002-09-01), Wang et al.
patent: 6446158 (2002-09-01), Karabatsos
patent: 6462412 (2002-10-01), Kamei et al.
patent: 6465877 (2002-10-01), Farnworth et al.
patent: 6465893 (2002-10-01), Khandros et al.
patent: 6473308 (2002-10-01), Forthun
patent: 6486544 (2002-11-01), Hashimoto
patent: 6514793 (2003-02-01), Isaak
patent: 6552910 (2003-04-01), Moon et al.
patent: 6560117 (2003-05-01), Moon
patent: 6590282 (2003-07-01), Wang et al.
patent: 6600222 (2003-07-01), Levardo
patent: 6620651 (2003-09-01), He et al.
patent: 6627984 (2003-09-01), Bruce et al.
patent: 6660561 (2003-12-01), Forthun
patent: 6677670 (2004-01-01), Kondo
patent: 2001/0040793 (2001-11-01), Inaba
patent: 2002/0006032 (2002-01-01), Karabatsos
patent: 2002/0101261 (2002-08-01), Karabatsos
patent: 2002/0139577 (2002-10-01), Miller
patent: 2002/0164838 (2002-11-01), Moon et al.
patent: 2002/0180022 (2002-12-01), Emoto
patent: 2003/0168725 (2003-09-01), Warner et al.
patent: 2004/0021211 (2004-02-01), Damberg
patent: 2004/0150107 (2004-08-01), Cha
patent: 0 298 211 (1989-01-01), None
patent: 58-96756 (1983-06-01), None
patent: 58-112348 (1983-07-01), None
patent: 60-254762 (1985-12-01), None
patent: 62-230027 (1987-10-01), None
patent: 2001077294 (2001-03-01), None
patent: 2001085592 (2001-03-01), None
patent: 2001332683 (2001-11-01), None
patent: 2003037246 (2003-02-01), None
patent: 2003086760 (2003-03-01), None
patent: 2003086761 (2003-03-01), None
patent: 2003309246 (2003-10-01), None
Dense-Pac Microsystems, Breaking Space Barriers, 3-D Technology 1993.
Dense-Pac Microsystems, DPS512X16A3, Ceramic 512K X 16 CMOS SRAM Module.
“Design Techniques for Ball Grid Arrays,” William R. Newberry, Xynetix Design Systems, Inc.
“Chip Scale Packaging and Redistribution,” Paul A. Magill, Glenn A. Rinne, J. Daniel Mis, Wayne C. Machon, Joseph W. Baggs, Unitive Electronics Inc.
“3D Interconnection for Ultra-Dense Multichip Modules,” Christian Val, Thomson-CSF DCS Computer-Division, Thierry Lemoine, Thomson-CSF RCM Radar Countermeasures Division.
“High Density Memory Packaging Technology High Speed Imaging Applications,” Dean Frew, Texas Instruments Incorporated.
Teresa Technologies, Inc.—Semiconductor Intellectual Property, Chip Scale Packaging—Website pages (3).
“Tessera Introduces uZ ™—Ball Stacked Memory Package for Computing and Portable Electronic Products” Joyce Smaragdis, Tessera Public Relations; 2 figures that purport to be directed to the uZ ™—Ball Stacked Memory Package.
Ron Bauer, Intel. “Stacked-CSP Delivers Flexibility, Realiability and Space-Saving Capabilities”, Spring 2002.
Tessera uZ Ball Stack Package. 4 figures that purport to be directed to the uZ—Ball Stacked Memory, 1 Page.
“Vertically-Intergrated Package.” Alvin Weinberg, Pacesetter, Inc. and W. Kinzy Jones, Florida International University.
Dense-Pac Microsystems, 256 Megabyte CMOS DRAM DP3ED32MS72RW5.
IBM Preliminary 168 Pin SDRAM Registered DlMM Functional Description & Timing Diagrams.
Cady James W.
Roper David L.
Wehrly, Jr. James Douglas
Wilder James
Andrews & Kurth LLP
Clark Jasmine
Denko J. Scott
Staktek Group L.P.
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