4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Roger Emigh

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Heat spreaders, heat spreader packages, and fabrication...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Integrated circuit protruding pad package system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Stacked die packaging and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2298145

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