Integrated circuit package with molded cell

Details Integrated circuit package with molded cell Integrated circuit package with molded cell

1990-11-21

1992-06-23

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 75, 357 80, 361392, H01L 2328, H01L 2302, H01L 2316, H05K 700

Patent

active

051247828

ABSTRACT:
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

REFERENCES:
patent: 4142287 (1979-03-01), Grabbe
patent: 5008776 (1991-04-01), Queyssac

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