Integrated circuit package with leadframe locked...

Details Integrated circuit package with leadframe locked... Integrated circuit package with leadframe locked...

2007-04-09

2008-08-19

Hoang, Quoc D (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S667000, C257SE23039

Reexamination Certificate

active

07413933

ABSTRACT:
A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. Electrical connections between the integrated circuit and the number of leads are made, and an encapsulant is formed over the integrated circuit and around the number of mold dams.

REFERENCES:
patent: 5648682 (1997-07-01), Nakazawa et al.
patent: 6551859 (2003-04-01), Lee et al.
patent: 6661083 (2003-12-01), Lee et al.
patent: 7217599 (2007-05-01), Punzalan et al.

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