Integrated circuit package with laminated backup cell

Details Integrated circuit package with laminated backup cell Integrated circuit package with laminated backup cell

1991-07-26

1992-10-06

James, Andrew J.

Static information storage and retrieval

Magnetic bubbles

Guide structure

357 70, 357 72, 365228, 365229, H01L 2316, H01L 2348, H01L 2944, H01L 2960

Patent

active

051537109

ABSTRACT:
An integrated circuit package encapsulates a memory chip and a laminated backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a device support plate on one side of the lead frame. The laminated battery is supported beneath the device support plate on the opposite side of the lead frame. A flat geometry interconnect media connects the electrodes of the laminated backup battery for wire bond interconnection with the positive and negative power input nodes of the memory chip. The interconnect media is in the form of a flexible, laminated strip having a central conductive laminate sandwiched between a pair of insulation laminates. The integrated circuit chip, the laminated battery, the interconnected media, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

REFERENCES:
patent: 3353999 (1967-11-01), Osborn
patent: 3375136 (1968-03-01), Biggar
patent: 4623598 (1986-11-01), Waki et al.
patent: 4982371 (1991-01-01), Bolan et al.
patent: 5055704 (1991-10-01), Link et al.
patent: 5091771 (1992-02-01), Bolan et al.

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