Integrated circuit package system with multiple molding

Details Integrated circuit package system with multiple molding Integrated circuit package system with multiple molding

2011-01-18

2011-01-18

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S676000, C257SE23038, C257SE23049, C257SE23056, C257SE21502, C257SE21504, C438S124000

Reexamination Certificate

active

07871863

ABSTRACT:
An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.

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