Integrated circuit package system with downset lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S673000

Reexamination Certificate

active

07443015

ABSTRACT:
An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.

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patent: 7042068 (2006-05-01), Ahn et al.
patent: 2002/0020907 (2002-02-01), Seo et al.
patent: 2005/0139972 (2005-06-01), Chiu et al.
patent: 2005/0258521 (2005-11-01), Park et al.

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