4. Telephonic communications
  5. Composite substation or terminal

Shu-Chen Huang

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package structure and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Ethernet switching hub

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Switch or casing therefor
Patent

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Fine conductive particles for making anisotropic conductive...

Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-646327

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