4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Mike Charles

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Integrated circuit package having interchip bonding and method t

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Integrated circuit package having interchip bonding and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-391460

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