Integrated circuit package and method of manufacture

Details Integrated circuit package and method of manufacture Integrated circuit package and method of manufacture

2006-08-08

2006-08-08

Vigushin, John B. (Department: 2841)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C438S125000, C029S832000, C029S852000, C361S793000

Reexamination Certificate

active

07087991

ABSTRACT:
An integrated circuit package and a method of manufacturing the package. A silicon chip is attached to the surface of a substrate or attached to the bottom surface of a cavity in the substrate so that the active surface of the chip is exposed. One or more build-up circuit structures are formed over the substrate. Each build-up circuit structure has at least one insulation layer, at least one patterned circuit layer and a plurality of via openings with conductive material therein so that bonding pads on the active surface of the chip connect electrically with the patterned circuit layer through the vias. To form a ball grid array package, solder balls may also be attached to the solder ball pads on the patterned circuit layer so that the bonding pads on the chip are electrically connected to an external circuit through the build-up circuit structure and the solder balls.

REFERENCES:
patent: 5111278 (1992-05-01), Eichelberger
patent: 5157589 (1992-10-01), Cole et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 6274391 (2001-08-01), Wachtler et al.
patent: 6400573 (2002-06-01), Mowatt et al.
patent: 6724079 (2004-04-01), Viswanathan et al.
patent: 2003/0134455 (2003-07-01), Cheng et al.
patent: 2004/0014317 (2004-01-01), Sakamoto et al.
patent: 10284632 (1998-10-01), None
patent: 2000260902 (2000-09-01), None
ACCURATUS data sheet for Aluminum Oxide (Alumina), publ. 2002, four sheets (Obtained on the Internet).
ACCURATUS data sheet for Aluminum Nitride, publ. 2002, two sheets (Obtained on the Internet).
Definition of “circuit” from Newnes Dictionary of Electronics, Newnes 1999 (one sheet).
Definition of “circuit” from Hargrave's Communications Dictionary, Wiley 2001 (one sheet).

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