Integrated circuit package

Details Integrated circuit package Integrated circuit package

1996-09-09

2000-02-29

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257690, 257723, 257724, 257711, 257712, 257924, H01L 2304, H01L 2348, H01L 2334

Patent

active

060312831

ABSTRACT:
An integrated circuit package which contains an integrated circuit. The internal integrated circuit is coupled to external lands located on a first outer surface of the package by a plurality of vias. The vias extend through the package from the first outer surface to an opposite second outer surface. The package has a plurality of devices such as capacitors that are mounted to the second outer surface. Some of the vias are connected to a whole group of external lands. Grouping the lands to a single via reduces the number of vias on the second surface of the package. The reduction in vias allows additional capacitors to be mounted to the second surface of the package.

REFERENCES:
patent: 5235211 (1993-08-01), Hambergen
patent: 5237204 (1993-08-01), Val
patent: 5319243 (1994-06-01), Leicht et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5625225 (1997-04-01), Huang et al.

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