Integrated circuit including, and fabrication method for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S234000

Reexamination Certificate

active

06902970

ABSTRACT:
Production of an insulated-gate field-effect transistor is begun and interrupted at an uncompleted point. Then, a bipolar transistor is almost completely produced. At that point, a return is made to the production of the insulated-gate field-effect transistor. Lastly, a finishing step common to both transistors and including common thermal annealing and common siliciding is performed.

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St. Onge, et al., “A 0.24 μm SiGe BiCMOS Mixed-Signal RF Production Technology Featuring a 47 Ghz ftHBT and 0.18 μm LeffCMOS”;Bipolar/BiCOMS Circuits and Technology Meeting, 1999, Proceedings of the 1999 Minneapolis, MN, Sep. 1999, Piscataway, NJ, IEEE, Sep. 26, 1999; pp. 117-120; XP010359517.
Hashimoto, et al., A 73 Ghz ft0.18 μm RF-SiGe BiCOMOS Technology considering Thermal Budget Trade-off and with reduced Boron-spike Effect on HBT Characteristics;International Electron Devices Meeting 2000, IEDM. Technocal Digest, San Francisco, CA and New York, NY, IEEE, Dec. 10-13, 2000; pp. 149-152, XP 000988821.

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