Integrated circuit encapsulation and method therefor

Details Integrated circuit encapsulation and method therefor Integrated circuit encapsulation and method therefor

2009-11-03

2010-12-28

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S417000, C257SE23002

Reexamination Certificate

active

07859068

ABSTRACT:
A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).

REFERENCES:
patent: 4059708 (1977-11-01), Heiss, Jr. et al.
patent: 5585669 (1996-12-01), Venambre
patent: 5605489 (1997-02-01), Gale et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 6316840 (2001-11-01), Otani
patent: 6335224 (2002-01-01), Peterson et al.
patent: 6379988 (2002-04-01), Peterson et al.
patent: 6395858 (2002-05-01), Mack et al.
patent: 6401545 (2002-06-01), Monk et al.
patent: 6420201 (2002-07-01), Webster
patent: 6432737 (2002-08-01), Webster
patent: 6441503 (2002-08-01), Webster
patent: 6472243 (2002-10-01), Gogoi et al.
patent: 6635509 (2003-10-01), Ouellet
patent: 6876090 (2005-04-01), Mensch et al.
patent: 6939734 (2005-09-01), Franosch et al.
patent: 6951769 (2005-10-01), Malone
patent: 7014888 (2006-03-01), McDonald et al.
patent: 7109055 (2006-09-01), McDonald
patent: 7192798 (2007-03-01), Okada et al.
patent: 7235431 (2007-06-01), Wood et al.
patent: 7273767 (2007-09-01), Ong et al.
patent: 7273787 (2007-09-01), Chen et al.
patent: 7462919 (2008-12-01), Engling et al.
patent: 2004/0023470 (2004-02-01), Hsu et al.
patent: 2004/0118214 (2004-06-01), McDonald et al.
patent: 2005/0048688 (2005-03-01), Patel et al.
patent: 2005/0130337 (2005-06-01), Wu et al.
patent: 03068670 (2003-08-01), None
Office Action Mailed Dec. 12, 2005 on Related U.S. Appl. No. 11/039,688.
Office Action Mailed Sep. 9, 2008, 2005 on Related U.S. Appl. No. 11/386,49.
Office Action Mailed Jan. 8, 2008, 2009 on Related U.S. Appl. No. 11/386,49.
Notice of Allowance Mailed Aug. 3, 2009, 2009 on Related U.S. Appl. No. 11/386,49.

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