Integrated circuit encapsulation and method therefor

Details Integrated circuit encapsulation and method therefor Integrated circuit encapsulation and method therefor

2006-05-16

2009-12-15

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S053000, C257SE21502

Reexamination Certificate

active

07632698

ABSTRACT:
A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).

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