Integrated circuit dielectric and method

Details Integrated circuit dielectric and method Integrated circuit dielectric and method

1998-05-28

1999-12-28

Crane, Sara

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257642, 257 3, H01L 2348, H01L 2358, H01L 4700

Patent

active

060085401

ABSTRACT:
A surface treatment for porous silica to enhance adhesion of overlying layers. Treatments include surface group substitution, pore collapse, and gap filling layer (520) which invades open surface pores (514) of xerogel (510).

REFERENCES:
patent: 5523615 (1996-06-01), Cho et al.

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