Integrated circuit device and subassembly

Details Integrated circuit device and subassembly Integrated circuit device and subassembly

1984-01-06

1985-07-02

James, Andrew J.

357 80, 357 75, H01L 2314, H01L 2502, H01L 2348

Patent

active

045271852

ABSTRACT:
The present invention relates to an integrated circuit device particularly of the type carrying multiple memory circuits or the like. The device incorporates a lead frame of the sort which includes an elongate metallic web and is characterized by the lead frame providing an integral seat or platform whereon is mounted a capacitor device which is connected or adapted to be connected in shunting relation of the power supply inputs to the integrated circuit device, whereby the capacitor provides a convenient mounting platform for the circuit bearing elements and also assures minimal lead lengths between the capacitor and the power supply inputs of the circuit bearing chip. Due to the shortness of such lead lengths and consequent reduction of the inductance reactance of the power supply circuit, efficient dampening of switching transients is achieved with the use of capacitors of much smaller values, in less area than heretofore required in external dampening applications.

REFERENCES:
patent: 3559285 (1971-02-01), Kauffman
patent: 3617817 (1971-11-01), Kawakastu
patent: 3866311 (1975-02-01), Salles et al.
patent: 3942245 (1976-03-01), Jackson et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4200880 (1980-04-01), Frey
patent: 4234666 (1980-11-01), Gursky
patent: 4249196 (1981-02-01), Durney et al.
patent: 4303934 (1981-12-01), Stitt
patent: 4454529 (1984-06-01), Philofsky et al.
"Decoupling Capacitor Placement"--Parisi--IBM Technical Disclosure, vol. 19, No. 8, pp. 3046-3047, 1-1977.

Affiliated with

Also associated with

Rating

Integrated circuit device and subassembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit device and subassembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit device and subassembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-384651