Integrated circuit cooling and insulating device and method

Details Integrated circuit cooling and insulating device and method Integrated circuit cooling and insulating device and method

2007-10-25

2009-02-03

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21499

Reexamination Certificate

active

07485497

ABSTRACT:
A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Further provided is a method of controlling chip temperature. This allows circuit and device designers an opportunity to design more efficient structures. Some properties that exhibit less variation when temperature ranges are controlled include electromigration, conductivity, operating speed, and reliability.

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