Integrated circuit chip structure for improved packaging

Details Integrated circuit chip structure for improved packaging Integrated circuit chip structure for improved packaging

1997-05-19

1999-05-04

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257780, 257784, 257773, H01L 2358, H01L 2348, H01L 2352

Patent

active

059006439

ABSTRACT:
First and second electrical components on an integrated circuit chip are electrically connected respectively to a wire bonding pad and to a probe contacting area of a size significantly less than the bonding pad. The pad and contacting area are electrically isolated whereby both components can be separately electrically tested by test probes contacting each of the pad and the contact area. After the components have been tested, the bonding pad and the probe contact area are electrically connected together for electrically connecting the first and second components. The electrical connection is made by bonding a terminal wire to the bonding pad as well as to an extension from the contact area substantially filling a space within the bonding pad and underlying the joint formed between the terminal wire and the bonding pad.

REFERENCES:
patent: 4984061 (1991-01-01), Matsumoto

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