Integrated capacitors fabricated with conductive metal oxides

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S650000, C438S663000, C427S126500

Reexamination Certificate

active

06869877

ABSTRACT:
A capacitor for a memory device is formed with a conductive oxide for a bottom electrode. The conductive oxide (RuOx) is deposited under low temperatures as an amorphous film. As a result, the film is conformally deposited over a three dimensional, folding structure. Furthermore, a subsequent polishing step is easily performed on the amorphous film, increasing wafer throughput. After deposition and polishing, the film is crystallized in a non-oxidizing ambient.

REFERENCES:
patent: 4446245 (1984-05-01), Hinden
patent: 5254217 (1993-10-01), Maniar et al.
patent: 5358889 (1994-10-01), Emesh et al.
patent: 5504041 (1996-04-01), Summerfelt
patent: 5576928 (1996-11-01), Summerfelt et al.
patent: 5600535 (1997-02-01), Jow et al.
patent: 5619393 (1997-04-01), Summerfelt et al.
patent: 5622893 (1997-04-01), Summerfelt et al.
patent: 5702970 (1997-12-01), Choi
patent: 5729054 (1998-03-01), Summerfelt et al.
patent: 5852307 (1998-12-01), Aoyama et al.
patent: 6025020 (2000-02-01), Chen et al.
patent: 6133159 (2000-10-01), Vaartstra et al.
patent: 6218233 (2001-04-01), Takemura
patent: 6281142 (2001-08-01), Basceri et al.
patent: 6284587 (2001-09-01), Yamauchi et al.
patent: 6329286 (2001-12-01), Vaartstra
patent: 6344413 (2002-02-01), Zurcher et al.
patent: 6387790 (2002-05-01), Domenicucci et al.
patent: 6649091 (2003-11-01), Ryan et al.
patent: 20010026963 (2001-10-01), Itatani et al.
patent: 20040014316 (2004-01-01), Nakamura
Abstract of Aoyama, T. et al., Ru electrode deposited by sputtering in ArO2mixture ambient,Japanese Journal of Applied Physics, Part 1vol. 37, No. 10, Oct. 1998, p. 5701-5707.
Abstract of Aoyama, T. et al., Interfacial layers between Si and Ru films deposited by sputtering in ArO2mixture ambient,Japanese Journal of Applied Physics, Part 2vol. 37, No. 2B, Feb. 1998, p. L242-244.

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