Integral design features for heatsink attach for electronic pack

Details Integral design features for heatsink attach for electronic pack Integral design features for heatsink attach for electronic pack

1997-12-17

1999-10-19

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257713, 257718, 361710, H05K 720

Patent

active

059699477

ABSTRACT:
An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

REFERENCES:
patent: 5200809 (1993-04-01), Kwon
patent: 5386144 (1995-01-01), Variot et al.

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