Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Inventor
active
Apparatus and process for improved die adhesion to organic chip
Assembly mounting techniques for heat sinks in electronic packag
Integral design features for heatsink attach for electronic pack
Integral design features for heatsink attach for electronic...
No associations
LandOfFree
Stephen John Kosteva does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Stephen John Kosteva, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stephen John Kosteva will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-182290