4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Stephen Wesley MacQuarrie

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Integral design features for heatsink attach for electronic pack

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Integral design features for heatsink attach for electronic...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Metal substrate having an IC chip and carrier mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Method of making interconnections between a multi-layer chip sta

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Semiconductor device package including a thick integrated circui

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Profile ID: LFUS-PAI-P-809281

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