Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2011-08-16
2011-08-16
Chen, Jack (Department: 2893)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C438S026000, C438S785000, C257SE21001
Reexamination Certificate
active
07998879
ABSTRACT:
An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
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Choi Seog Moon
Lee Young Ki
Shin Sang Hyun
Chen Jack
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
Samsung LED Co., Ltd.
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