Insulation structure for high temperature conditions and...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

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C438S026000, C438S785000, C257SE21001

Reexamination Certificate

active

07998879

ABSTRACT:
An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

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Chinese Office Action, w/ English translation thereof, issued in Chinese Patent Application No. CN 200710087206.2 dated Jan. 23, 2009.
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Japanese Office Action, w/ English translation thereof, issued in Japanese Patent Application No. JP 2007-069924 dated Mar. 2, 2010.
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. 2007-069924, dated Sep. 14, 2010.

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