Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Reexamination Certificate
2005-06-07
2005-06-07
Stafira, Michael P. (Department: 2877)
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
Reexamination Certificate
active
06903821
ABSTRACT:
Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents. When a desired item name is clicked, the picture plane is switched and the contents corresponding to the clicked item name are displayed.
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Hayakawa Kohichi
Hiroi Takashi
Ito Maki
Machida Kazuhisa
Morioka Hiroshi
Kenyon & Kenyon
Stafira Michael P.
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