Inorganic seal for encapsulation of an organic layer and method

Details Inorganic seal for encapsulation of an organic layer and method Inorganic seal for encapsulation of an organic layer and method

1997-09-30

1998-12-29

Niebling, John

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Multiple layers

438780, 438958, H01L 2131, H01L 21469

Patent

active

058541411

ABSTRACT:
An inorganic seal for encapsulation of an organic layer during passivation of an integrated circuit device and method for making the same is disclosed. The seal creates a structure which forms an inorganic to inorganic passivation seal over Reactive Ion Etched (RIE) edges in an all organic planar back end of the line (BEOL) insulator. The edge seal prevents the delamination of the passivation layer from the integrated circuit device or a metallization ring which may lead to subsequent formation of moisture-filled channels and corrosion of the metal lines of the device and the failure of the integrated circuit.

REFERENCES:
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patent: 5126290 (1992-06-01), Lowrey et al.
patent: 5294295 (1994-03-01), Gabriel
patent: 5318950 (1994-06-01), Etrillard
patent: 5356834 (1994-10-01), Sugimoto et al.
patent: 5472900 (1995-12-01), Vu et al.

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