4. Plastic and nonmetallic article shaping or treating: processes
  5. With severing, removing material from preform mechanically,...
  6. Flash or sprue removal type

Seiji Kegai

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Board for IC card having component mounting recess

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Injection molding method for board for IC card

Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Flash or sprue removal type
Patent

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Profile ID: LFUS-PAI-P-272824

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