Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-04-01
1999-09-21
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361700, 361704, 361719, 257714, 257715, 174 152, 165 804, 29890032, H05K 720
Patent
active
059562293
ABSTRACT:
A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.
REFERENCES:
patent: 4204246 (1980-05-01), Arii et al.
patent: 4612978 (1986-09-01), Cutchaw
patent: 5095404 (1992-03-01), Chao
patent: 5331510 (1994-07-01), Ouchi et al.
patent: 5353192 (1994-10-01), Nordin
patent: 5355942 (1994-10-01), Conte
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5412535 (1995-05-01), Chao et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5699227 (1997-12-01), Kolman et al.
Brownell Michael
Haley Kevin
McCutchan Dan
Xie Hong
Chervinsky Boris L.
Intel Corporation
Picard Leo P.
LandOfFree
Injection molded thermal interface system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Injection molded thermal interface system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Injection molded thermal interface system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-86149