Injection molded solder ball method

Details Injection molded solder ball method Injection molded solder ball method

2011-06-07

2011-06-07

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000

Reexamination Certificate

active

07955966

ABSTRACT:
Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

REFERENCES:
patent: 6090301 (2000-07-01), Mizukoshi et al.
patent: 2006/0035454 (2006-02-01), Belanger et al.

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