Inductively enhanced reactive ion etching

Details Inductively enhanced reactive ion etching Inductively enhanced reactive ion etching

1994-11-01

1997-03-04

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

216 71, 118723I, 156345, 31511151, C23F 400

Patent

active

056075421

ABSTRACT:
A method and apparatus for generating a medium density plasma in a reactive ion etching chamber. A conventional reactive ion etching technique, using multiple electrodes for capacitive coupling of power into the chamber to establish and sustain a plasma, is combined with inductive coupling for plasma enhancement only. A first source of high frequency power is coupled to at least one of the electrodes to generate the plasma under conditions similar to those used in a conventional reactive ion etching system, and a second source of high frequency power is coupled to an inductive coil surrounding the plasma, to enhance the plasma density without adversely affecting wafers being processed in the chamber.

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