Increased surface area of an STC structure via the use of a stor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438637, H01L 218242

Patent

active

057100748

ABSTRACT:
A method of creating an STC structure, used for high density, DRAM designs, has been developed. The process consists of creating a lower, or storage node electrode, for the STC structure, consisting of multiple, polysilicon mesa structures, as well as polysilicon spacers, on the sides of the polysilicon mesas, with the polysilicon spacers protruding above the top surface of the polysilicon mesas. This is accomplished by initially creating a composite mesa structure, of an insulator layer, on a partially etched polysilicon layer. After creation of the polysilicon spacer, on the sides of the composite, mesa structure, the insulator is selectively removed, resulting in polysilicon mesas, with protruding polysilicon spacers. This storage node configuration results in an significant increase of surface area, when compared to storage nodes fabricated with flat topographies.

REFERENCES:
patent: 5061650 (1991-10-01), Dennison et al.
patent: 5447882 (1995-09-01), Kim
patent: 5468670 (1995-11-01), Ryou
patent: 5492850 (1996-02-01), Ryou

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