Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate
2005-12-13
2005-12-13
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Applying or distributing fused filler
Reexamination Certificate
active
06974071
ABSTRACT:
An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.
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Buley Todd H.
Chapman Brian
Lam Roger
Ma Wai Mon
Weir John P.
Blecker Ira D.
DeLio & Peterson LLC
Johnson Jonathan
Peterson Peter W.
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