4. Metal fusion bonding
  5. Process
  6. Plural joints

Wai Mon Ma

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High melting point solder ball coated with a low melting point s

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Inclined solder wave methodology for wave soldering double...

Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate

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Method and apparatus for reworking ceramic ball grid array...

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Reexamination Certificate

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Method and structure for repairing or modifying surface...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method and structure for repairing or modifying surface...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1202873

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