Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2005-05-25
2010-11-23
Ryan, Patrick (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C205S082000, C205S096000, C205S123000
Reexamination Certificate
active
07837851
ABSTRACT:
A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
REFERENCES:
patent: 2689216 (1954-09-01), Nevers et al.
patent: 3915834 (1975-10-01), Wright et al.
patent: 4267024 (1981-05-01), Weiskopf
patent: 4279707 (1981-07-01), Anderson et al.
patent: 4534832 (1985-08-01), Doiron, Jr.
patent: 4828654 (1989-05-01), Reed
patent: 5156730 (1992-10-01), Bhatt et al.
patent: 5256274 (1993-10-01), Poris
patent: 5298280 (1994-03-01), Kaczur et al.
patent: 5368702 (1994-11-01), de Nora
patent: 5443707 (1995-08-01), Mori
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 6093291 (2000-07-01), Izumi et al.
patent: 6110346 (2000-08-01), Reid et al.
patent: 6126798 (2000-10-01), Reid et al.
patent: 6187164 (2001-02-01), Warren et al.
patent: 6210554 (2001-04-01), Kosaki et al.
patent: 6261433 (2001-07-01), Landau
patent: 6551483 (2003-04-01), Mayer et al.
patent: 6562204 (2003-05-01), Mayer et al.
patent: 6587118 (2003-07-01), Yoneda
patent: 6793792 (2004-09-01), Jones et al.
patent: 6830673 (2004-12-01), Yahalom et al.
patent: 6866763 (2005-03-01), Basol et al.
patent: 7160421 (2007-01-01), Wilson et al.
patent: 7279084 (2007-10-01), Chalupa et al.
patent: 7368042 (2008-05-01), Hsu et al.
patent: 2003/0000604 (2003-01-01), Bishop et al.
patent: 2003/0201770 (2003-10-01), Hanawa et al.
patent: 2004/0084316 (2004-05-01), Muranaka
patent: 2004/0192066 (2004-09-01), Lumomirsky et al.
patent: 2004/0256222 (2004-12-01), Griego et al.
patent: 2102836 (1983-12-01), None
patent: 968104 (1982-10-01), None
patent: WO 99/25902 (1999-05-01), None
patent: WO 99/25903 (1999-05-01), None
patent: WO 99/41434 (1999-08-01), None
F. A. Lowenheim, Electroplating, McGraw-Hill Book Company, New York, 1978, pp. 12-24.
A. Kenneth Graham, editor, Electroplating Engineering Handbook, Reinhold Publishing Corporation, New York, 1962, pp. 480-490.
U.S. Appl. No. 09/586,736 entitled “Programmable Anode Apparatus and Associated Method”, filed Jun. 5, 2000.
Birang Manoocher
Donoso Bernardo
Kovarsky Nicolay Y.
Applied Materials Inc.
Leader William T
Patterson & Sheridan
Ryan Patrick
LandOfFree
In-situ profile measurement in an electroplating process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with In-situ profile measurement in an electroplating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ profile measurement in an electroplating process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4249923