In-situ pre-ILD deposition treatment to improve ILD to metal adh

Details In-situ pre-ILD deposition treatment to improve ILD to metal adh In-situ pre-ILD deposition treatment to improve ILD to metal adh

1996-12-17

1999-09-07

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438677, 438656, 438685, H01L 2144

Patent

active

059501073

ABSTRACT:
A method for improving interlayer dielectric to metal layer adhesion including an in-situ plasma treatment process. A metal layer which is formed on a substrate is treated with plasma prior to the deposition of the interlayer dielectric. The interlayer dielectric is deposited above the metal layer and contacts are formed through the interlayer dielectric which electrically connect the underlying metal layer to a subsequently formed metal layer. The plasma treatment step creates open molecular bonds on the surface of the metal layer which cause the interface between the metal layer and the interlayer dielectric to become more adhesive. Thus, decreasing the likelihood of delamination that degrades the electrical reliability of the device.

REFERENCES:
patent: 4837185 (1989-06-01), Yau et al.
patent: 5427666 (1995-06-01), Mueller et al.
patent: 5563105 (1996-10-01), Dobuzinsky et al.
patent: 5612253 (1997-03-01), Farahani et al.
patent: 5700711 (1997-12-01), Hsu et al.
patent: 5789040 (1998-08-01), Martinu et al.
patent: 5856238 (1999-01-01), Jung
patent: 5872064 (1999-02-01), Huff et al.
patent: 5872401 (1999-02-01), Huff et al.

Affiliated with

Also associated with

Rating

In-situ pre-ILD deposition treatment to improve ILD to metal adh does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In-situ pre-ILD deposition treatment to improve ILD to metal adh, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ pre-ILD deposition treatment to improve ILD to metal adh will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1814909