Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-09-05
2006-09-05
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C257SE21526
Reexamination Certificate
active
07101722
ABSTRACT:
A method for determination of tunnel oxide weakness is provided. A tunnel oxide layer is formed on a semiconductor wafer. At least one poly gate is formed on the tunnel oxide layer in a flash memory region of the semiconductor wafer. At least one poly island, which is substantially larger than the poly gate, is formed on the tunnel oxide layer in a voltage contrast cell region of the semiconductor wafer. The poly island and the tunnel oxide layer therebeneath form a voltage contrast tunnel oxide cell. A voltage contrast measurement is performed on the voltage contrast tunnel oxide cell. The voltage contrast measurement is then compared with prior such voltage contrast measurements on other such voltage contrast tunnel oxide cells. The tunnel oxide weakness of the tunnel oxide layer is then determined from the voltage contrast measurement comparisons.
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Erhardt Jeffrey P.
Hill Wiley Eugene
Wang John J.
Advanced Micro Devices , Inc.
Coleman W. David
Mikio Ishimaru
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