In line system used in a semiconductor package assembling

Details In line system used in a semiconductor package assembling In line system used in a semiconductor package assembling

2006-05-30

2006-05-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S025010, C029S742000, C029S759000, C029S827000, C438S462000

Reexamination Certificate

active

07051428

ABSTRACT:
A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.

REFERENCES:
patent: 5068567 (1991-11-01), Jones
patent: 5961768 (1999-10-01), Tsujimoto
patent: 5981391 (1999-11-01), Yamada
patent: 6048749 (2000-04-01), Yamada
patent: 6153536 (2000-11-01), Brouillette et al.

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