4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Dong-Kuk Kim

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Actuated mirror array and method for the fabricating thereof

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Apparatus and method for wafer backside inspection

Measuring and testing – Inspecting
Reexamination Certificate

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Apparatus for bonding a chip using an insulating adhesive tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Reexamination Certificate

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Apparatus for stacking semiconductor chips, method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Apparatus for stacking semiconductor chips, method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-271712

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