Impurity doping method

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma

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438567, H01L 21263

Patent

active

058519068

ABSTRACT:
In order to dope impurities selectively at low temperature where the resist can be used, the invention presents an impurity doping method capable of performing not only cleaning process but also doping process at low temperature where the resist can be used. First, the active sample surface of a solid sample is exposed by irradiation with plasma, and without active irradiation with plasma, the gas or vapor containing object impurities is contacted with the active sample surface of the solid sample to dope the impurities. As a result, the impurity doping process at the time of formation of C-MOS structure or the like can be executed at low temperature so as not to spoil the function of the resist.

REFERENCES:
patent: 4465529 (1984-08-01), Arima et al.
patent: 4912065 (1990-03-01), Mizuno et al.
patent: 4937205 (1990-06-01), Nakayama et al.
1993 Symposium on VLSI Technology, May 17-19, 1993.

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