Implant optimization scheme

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

Reexamination Certificate

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C438S373000, C438S302000, C438S369000, C438S370000, C438S506000, C438S514000, C438S519000

Reexamination Certificate

active

11006257

ABSTRACT:
The present invention provides a method for implanting ions in a substrate and a method for manufacturing an integrated circuit. The method for implanting ions in a substrate, among other steps, including placing a substrate (410) on an implant platen (405) such that a predominant axes (430) of the substrate (410) is rotated about 30 degrees to about 60 degrees or about 120 degrees to about 150 degrees offset from a radial with respect to the implant platen (405), and further wherein the substrate (410) is not tilted. The method further includes implanting ions into the substrate (410), the rotated position of the predominant axes (430) reducing shadowing.

REFERENCES:
patent: 2003/0155533 (2003-08-01), Iwasawa et al.
patent: 2004/0099818 (2004-05-01), Jun et al.
patent: 2004/0137687 (2004-07-01), Feudel et al.
patent: 2004/0232350 (2004-11-01), Iwasawa et al.
patent: 2006/0001109 (2006-01-01), Shaheen et al.
Kenji Yoneda, et al.; “The Drain Current Asymmetry of 130nm MOSFETs due to Extension Implant Shadowing Originated by Mechanical Angle Error in High Current Implanter”; Extended Abstracts of the Third International Workshop on Junction Technology, Dec. 2-3, 2002, pp. 19-22.
S.R. Walther, et al.; “Dopant Channeling as a Function of Implant Angle for Low Energy Application”; 1999 IEEE; pp. 126-129.
Lenoard M. Rubin, et al.; “Process Control Issues for Retrograde Well Implants for narrow n+/p+ Isolation in CMOS”; Proc. of the XIV Int'l Conf. on Ion Implantation Technology, Taos, NM, 2002, pp. 17-20.

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