Photocopying – Projection printing and copying cameras – With temperature or foreign particle control
Reexamination Certificate
2007-02-20
2007-02-20
Rutledge, D. (Department: 2851)
Photocopying
Projection printing and copying cameras
With temperature or foreign particle control
C355S053000, C355S076000, C355S071000, C378S034000, C378S035000
Reexamination Certificate
active
11009505
ABSTRACT:
An immersion optical projection system for photolithography is provided. A transparent plate is located between a last lens element and the wafer during a usage of the system. The transparent plate has a lens-side surface and a wafer-side surface. The system is adapted to have a layer of lens-side fluid located between the last lens element and the lens-side surface of the transparent plate, e.g., when the last lens element is operably located over the wafer during a photolithography process. The system is also adapted to have a layer of wafer-side fluid located between the wafer-side surface of the transparent plate and the wafer, during a usage of the system. The wafer-side fluid may or may not be fluidly connected to the lens-side fluid. The wafer-side fluid may or may not differ from the lens-side fluid.
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Mulkens, J., et al., “Study on Immersion Lithography,” Immersion Lithography Workshop ISMT, Jul. 11, 2003, Slides 1-24.
Owa, S., et al., “Immersion Lithography Exposure Tool Update,” Immersion Lithography Workshop, Jul. 11, 2003, Slides 1-30.
Lin, Burn J., “Immersion lithography and its impact on semiconductor manufacturing,” 2004 Society of Photo-Optical Instrumentation Engineers, Jul. 2004, pp. 337-395.
Chen Chun-Kuang
Gau Tsai-Sheng
Lin Burn-Jeng
Lin Chin-Hsiang
Liu Ru-Gun
Rutledge D.
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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