Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2011-04-12
2011-04-12
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257SE31127, C257S432000, C257S680000, C250S208100, C438S065000, C438S116000
Reexamination Certificate
active
07923793
ABSTRACT:
An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.
REFERENCES:
patent: 5510273 (1996-04-01), Quinn
patent: 5650363 (1997-07-01), Endroes et al.
patent: 6486541 (2002-11-01), Usami et al.
patent: 6791072 (2004-09-01), Prabhu
patent: 6881943 (2005-04-01), Yegnashankaran
patent: 7507944 (2009-03-01), Arnzen et al.
patent: 7626621 (2009-12-01), Ito et al.
patent: 7633149 (2009-12-01), Fischer et al.
patent: 7786421 (2010-08-01), Nikzad et al.
patent: 2001/0020671 (2001-09-01), Ansorge et al.
patent: 2002/0197771 (2002-12-01), Dotta et al.
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2004/0023469 (2004-02-01), Suda
patent: 2005/0263836 (2005-12-01), Okada et al.
patent: 2006/0038183 (2006-02-01), Oliver
patent: 2005-260436 (2005-09-01), None
Choi Min-seog
Jung Kyu-dong
Kim Che-heung
Kim Woon-bae
Lee Eun-sung
Chu Chris
Samsung Electronics Co,. Ltd.
Sughrue & Mion, PLLC
LandOfFree
Image sensor module and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Image sensor module and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor module and fabrication method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2715251