Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2006-06-07
2009-06-30
Ngo, Ngan (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S696000, C257S774000, C257SE23002, C257SE23151
Reexamination Certificate
active
07554184
ABSTRACT:
A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
REFERENCES:
patent: 5034800 (1991-07-01), Marchisi
patent: 5343076 (1994-08-01), Katayama et al.
patent: 6048754 (2000-04-01), Katayama et al.
patent: 6313525 (2001-11-01), Sasano
patent: 6649834 (2003-11-01), Hsieh et al.
patent: 6661103 (2003-12-01), Akram
patent: 6835960 (2004-12-01), Lin et al.
patent: 6956283 (2005-10-01), Peterson
patent: 7199400 (2007-04-01), Sasuga
patent: 2003/0232461 (2003-12-01), Bolken et al.
patent: 2004/0245530 (2004-12-01), Kameyama et al.
patent: 2005/0009239 (2005-01-01), Wolff et al.
patent: 2006/0202210 (2006-09-01), Mok et al.
Webster Steven
Wu Ying-Cheng
Altus Technology Inc.
Cheng Andrew C.
Ngo Ngan
LandOfFree
Image sensor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Image sensor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor chip package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4146198