III-nitride light emitting devices fabricated by substrate...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

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C438S455000

Reexamination Certificate

active

07491565

ABSTRACT:
Devices and techniques for fabricating InAlGaN light-emitting devices are described that result from the removal of light-emitting layers from the sapphire growth substrate. In several embodiments, techniques for fabricating a vertical InAlGaN light-emitting diode structure that result in improved performance and or cost-effectiveness are described. Furthermore, metal bonding, substrate liftoff, and a novel RIE device separation technique are employed to efficiently produce vertical GaN LEDs on a substrate chosen for its thermal conductivity and ease of fabrication.

REFERENCES:
patent: 4243996 (1981-01-01), Lebailly et al.
patent: 4738935 (1988-04-01), Shimbo et al.
patent: 5004705 (1991-04-01), Blackstone
patent: 5196375 (1993-03-01), Hoshi
patent: 5390210 (1995-02-01), Fouquet et al.
patent: 5496766 (1996-03-01), Amano et al.
patent: 5688714 (1997-11-01), Widdershoven et al.
patent: 5777350 (1998-07-01), Nakamura et al.
patent: 5804834 (1998-09-01), Shimoyama et al.
patent: 5821571 (1998-10-01), Lebby et al.
patent: 5837561 (1998-11-01), Kish et al.
patent: 5838707 (1998-11-01), Ramdani et al.
patent: 5862167 (1999-01-01), Sassa et al.
patent: 5952681 (1999-09-01), Chen
patent: 5985687 (1999-11-01), Bowers et al.
patent: 6033927 (2000-03-01), Shibata et al.
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6100104 (2000-08-01), Haerle
patent: 6104044 (2000-08-01), Iyechika et al.
patent: 6110277 (2000-08-01), Braun
patent: 6111272 (2000-08-01), Heinen
patent: 6136623 (2000-10-01), Hofstetter et al.
patent: 6153010 (2000-11-01), Kiyoku et al.
patent: 6156584 (2000-12-01), Itoh et al.
patent: 6194743 (2001-02-01), Kondoh et al.
patent: 6277696 (2001-08-01), Carey et al.
patent: 6291839 (2001-09-01), Lester
patent: 6376269 (2002-04-01), Chan et al.
patent: 6420199 (2002-07-01), Coman et al.
patent: 6559075 (2003-05-01), Kelly et al.
patent: 195 11 415 (1995-03-01), None
patent: 195 36 434 (1997-04-01), None
patent: 197 15 572 (1997-04-01), None
patent: 199 45 465 (1999-09-01), None
patent: 0 051 172 (1981-10-01), None
patent: 0 444 630 (1991-02-01), None
patent: 0 860 913 (1998-08-01), None
patent: 2 423 869 (1978-04-01), None
patent: 2307 791 (1997-06-01), None
patent: WO9814986 (1998-04-01), None
Handbook of Chemistry and Physics, 1976-1977, CRC Press, 57th Ed., pp. B47-B-48.
Ng, Complete Guide to Semiconductor Devices, 1995, pp. 392-393.
J.J. Dudley, D.I. Babic, R. Mirin, L. Yang, B.I. Miller, R.J. Ram, T. Reynolds, E.L. Hu, and J.E. Bower, “Low Threshold, Wafer Fused Long Wavelength Vertical Cavity Lasers”, Applied Physics Letters 64 (12), pp. 1463-1465.
English language abstract of DE19945465, 1 page.
English language abstract of EP0051172, B1, 1 page.
X. Li, I.W. Tao and W.I. Wang, “‘Flip-chip’ transfer of ZnSSe/ZnSe/CdZnSe LED films,” Electronic Letters, Mar. 16, 1995, vol. 31, No. 6, pp. 491-493.

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