III-nitride crystal manufacturing method, III-nitride...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Plural fluid growth steps with intervening diverse operation

Reexamination Certificate

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C438S500000, C257SE29089

Reexamination Certificate

active

07998847

ABSTRACT:
Affords methods of manufacturing bulk III-nitride crystals whereby at least the surface dislocation density is low globally.The present III-nitride crystal manufacturing method includes: a step of preparing an undersubstrate (1) containing a III-nitride seed crystal, the III-nitride seed crystal having a matrix (1s), and inversion domains (1t) in which the polarity in the <0001> directions is inverted with respect to the matrix (1s); and a step of growing a III-nitride crystal (10) onto the matrix (1s) and inversion domains (1t) of the undersubstrate (1) by a liquid-phase technique; and is characterized in that a first region (10s), being where the growth rate of III-nitride crystal (10) growing onto the matrix (1s) is greater, covers second regions (10t), being where the growth rate of III-nitride crystal (10) growing onto the inversion domains (1t) is lesser.

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Masanori Morishita et al. , “The Influences of Supersaturation on LPE Growth of GaN Single Crystals Using the Na Flux Method,” Journal of Crystal Growth, Oct. 2004, pp. 402-408, vol. 270, Elsevier, NY.

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