IC tiling pattern method, IC so formed and analysis method

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000

Reexamination Certificate

active

07669159

ABSTRACT:
The invention provides a method for providing an integrated circuit (6) having a substantially uniform density between parts (10, 12, 14and16) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns (32, 34) oriented substantially parallel to electrical structure regardless of their angle. A method of electrical analysis based on this provision is also provided as is a related program product.

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