IC tester having region in which various test conditions are...

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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Details

C714S738000

Reexamination Certificate

active

06223318

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to IC testers for testing the electrical characteristics of an IC (Integrated Circuit), and more particularly to an IC tester that can set a plurality of test conditions.
2. Description of the Background Art
In accordance with increase in the integration density and incorporation of multifunctions in an IC, the circuit complexity and the number of input and output terminals have been increased. The time required for testing the electrical characteristics of such an IC is getting longer since measurement covering a great number of items must be taken. In general, an IC tester is widely used for testing an IC. The performance of the IC tester will greatly contribute to reduce the time required for testing.
FIG. 1
is a block diagram showing a schematic structure of a conventional IC tester. The IC tester includes an CPU (Central Processing Unit)
1
for providing the overall control of the IC tester, a reference signal generation circuit
2
for generating a reference signal used in forming a test waveform, a control circuit
3
for controlling each circuit in testing an IC
12
of interest, a reference signal delay circuit
4
for delaying the reference signal generated by reference signal generation circuit
2
, a test pattern storage circuit
5
for storing a test pattern of under-testing IC
12
, a delay amount storage circuit for storing the amount of delay by reference signal delay circuit
4
, a test waveform formation circuit
7
for forming a test waveform according to signals output from reference signal delay circuit
4
and test pattern storage circuit
5
, a voltage amplify circuit
8
for amplifying the voltage of the signal output from test waveform formation circuit
7
, a voltage supply circuit
9
for supplying a voltage to voltage amplify circuit
8
, a D/A (digital/analog) conversion data storage circuit
10
for holding input data and providing the data to voltage supply circuit
9
, and a control signal transmission bus
13
that is used by CPU
1
in providing data to respective circuits. In testing IC
12
, control circuit
13
provides an address
14
to test pattern storage circuit
5
and delay amount storage circuit
6
.
FIG. 1
depicts the schematic structure of one channel for the IC tester. The IC tester includes a plurality of the circuitry shown in FIG.
1
. In testing IC
12
, CPU
1
sets the data for test pattern storage circuit
5
, delay amount storage circuit
6
and D/A conversion data storage circuit
10
for each channel.
The process of forming a test waveform input to under-testing IC
12
will be described hereinafter. CPU
1
includes an internal memory for storing a test program according to the test specification of under-testing IC
12
and test conditions. CPU
1
executes the test program to generate a test waveform according to a plurality of test items. The generated test waveform is provided to under-testing IC
12
. For example, CPU
1
has all the test patterns required for testing prestored in test pattern storage circuit
5
when testing is to be carried out. In executing the first test item, CPU
1
has the amount of delay corresponding to the time from the transition of the reference signal until the transition of the test waveform stored for each test pattern in delay amount storage circuit
6
. The voltage value of that output waveform is stored in D/A conversion data storage circuit
10
. Then, the test is initiated. In general, CPU
1
has the data for executing the next test item stored in delay amount storage circuit
6
and D/A conversion data storage circuit
10
after the test of the previous test item is completed.
Reference signal generation circuit
2
generates a reference signal for testing IC
12
. The cycle of a reference signal corresponds to the cycle of the test waveform generated by test waveform formation circuit
7
.
Test pattern storage circuit
5
holds the test pattern of the test item stored by CPU
1
. When IC
12
is tested, a test pattern is sequentially provided to test waveform formation circuit
7
in synchronization with the change of address signal
14
applied from control circuit
3
.
Delay amount storage circuit
6
holds the amount of delay stored by CPU
1
. When IC
12
is tested, the amount of delay is provided to reference signal delay circuit
4
in synchronization with the change in address signal
14
output from control circuit
3
. The details of delay amount storage circuit
6
will be described afterwards. Reference signal delay circuit
4
delays the reference signal output from reference signal generation circuit
2
in a programmable manner according to the amount of delay from delay amount storage circuit
6
. The delayed signal is provided to test waveform formation circuit
7
.
Test waveform formation circuit
7
holds the test pattern output from test pattern storage circuit
5
in synchronization with the delayed reference signal output from reference signal delay circuit
4
. The output of test waveform formation circuit
7
is provided to voltage amplify circuit
8
.
D/A conversion data storage circuit
10
holds and provides to voltage supply circuit
9
the digital data stored by CPU
1
. Voltage supply circuit
9
converts the digital data into an analog voltage value, which is provided to voltage amplify circuit
8
. Voltage amplify circuit
8
amplifies the voltage of the test waveform output from test waveform formation circuit
7
according to the analog voltage value from voltage supply circuit
9
. The amplified voltage is provided to under-testing IC
12
.
When the IC tester is executing one test item, CPU
1
issues a control signal via transmission bus
13
to store data into test pattern storage circuit
5
, delay amount storage circuit
6
, and D/A conversion data storage circuit
10
. Then, CPU
1
sends to control circuit
3
an instruction to initiate testing of IC
12
. Control circuit
3
responds to this instruction from CPU
1
to increment address signal
14
provided to test pattern storage circuit
5
and delay amount storage circuit
6
in synchronization with a reference signal output from reference signal generation circuit
2
. Test pattern storage circuit
5
and delay amount storage circuit
6
sequentially provide the test pattern and delay amount corresponding to address signal
14
, respectively. Test waveform formation circuit
7
produces a test waveform according to the delayed reference signal from reference signal delay circuit
4
and the test pattern from test pattern storage circuit
5
. The test waveform is provided to voltage amplify circuit
8
. Here, delay amount storage circuit
6
and D/A conversion data storage circuit
10
are referred to as “test condition storage circuit”, and test waveform formation circuit
7
and voltage amplify circuit
8
are referred to as “waveform formation circuit”.
By sequentially carrying out the above process for each test item, the testing operation on IC
12
is carried out. In general, D/A conversion data storage circuit
10
continuously outputs the data set by CPU
1
prior to the test until the entire test is completed.
FIG. 2
is a block diagram showing a specific structure of delay amount storage circuit
6
of FIG.
1
. Delay amount storage circuit
6
includes a pointer storage circuit
20
storing the pointer used in selecting an amount of delay, and a delay amount storage table
21
for storing the amount of data that is provided to reference signal delay circuit
4
and three-state buffers
22
and
23
.
Delay amount storage circuit
6
is taken as an example to be described hereinafter of the storage circuits such as delay amount storage circuit
6
and D/A conversion data storage circuit
10
that has data updated rather frequently.
A plurality of delay amount data that will be used by reference signal delay circuit
4
are stored in delay amount storage table
21
by CPU
1
. The pointer of the delay amount data stored in delay amount storage table
21
is stored in pointer storage cir

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