Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-07-27
1989-09-26
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156645, 156662, 156345, 511313, 437225, 437946, B24B 5702, H01L 21302
Patent
active
048697796
ABSTRACT:
A device for hydroplane polishing an exposed face of a sample includes a sample support having freedom of movement in a direction perpendicular to the exposed face; a polishing member having a surface opposite the exposed face; and a polishing fluid source for directing polishing fluid to a limited zone in the vicinity of the exposed face at sufficient pressure to cause the exposed face to hydroplane relative to the surface. Also, a device for rotating a sample relative to a surface for polishing a face of the sample using fluid in the space between the sample face and the surface includes a sample support held in a housing by an air bearing, and a source of air flow for rotating the support. Also, a device for hydroplane polishing includes a positive drive to rotate the sample support. Also, a device for polishing an exposed face of a sample includes a positive drive to rotate the sample and a positive drive to rotate the polishing member. Also, a device for hydroplane polishing includes a positive drive to rotate the polishing member, the sample also rotating. Also, a device for hydroplane polishing includes a polishing member that rotates around an axis and a mechanism for causing non-epicyclic motion of the exposed face relative to the axis.
REFERENCES:
patent: 3128988 (1964-04-01), Mandroian
patent: 3549439 (1970-12-01), Kaveggia et al.
patent: 3762103 (1973-10-01), Nielsen
patent: 3841031 (1974-10-01), Walsh
patent: 3842544 (1974-10-01), Paola
patent: 3857123 (1974-12-01), Walsh
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4244775 (1981-01-01), D'Asaro
patent: 4256535 (1981-03-01), Banks
patent: 4323422 (1982-04-01), Calawa et al.
patent: 4373991 (1983-02-01), Banks
patent: 4600469 (1986-07-01), Fusco et al.
patent: 4612733 (1986-09-01), Lee
Gormley et al., Rev. Sci. Instrum., "Hydroplane Polishing of Semiconductor Crystals", vol. 52, pp. 1256-1258 (4/22/81).
Rideout, Journal, "An Improved Polishing Technique for GaAs", (7/6/72).
Vora et al., "Surface Finishing Using Soft Abrasives", pp. 262-267.
Myers et al., "Growth of Low Dislocation Density CdTe Films on Hydroplaned CdTe Substrates by Molecular Beam Epitaxy", pp. 1598-1603 (5/20/83).
Hyama et al., Review of the Electrical Comm. Lab., "A Prototype Discal Chemical Polishing Machine for GaAs", vol. 17, pp. 1022-1036 (9/69).
Karaki, "Surface Polishing Method", Abstract.
Hartnagel et al., J. of Materials Science, "A Contribution to Etch Polishing of GaAs", vol. 8, pp. 1061-1063 (4/10/73).
Anderson Andrew J.
Lacey David L.
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