Hydrophobic processing apparatus including a liquid delivery sys

Details Hydrophobic processing apparatus including a liquid delivery sys Hydrophobic processing apparatus including a liquid delivery sys

1994-01-28

1996-04-09

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

Crucible or evaporator structure

118715, C23C 1600

Patent

active

055057810

ABSTRACT:
An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

REFERENCES:
patent: 4459267 (1984-07-01), Bunce
patent: 4870923 (1989-10-01), Sugimoto
patent: 4892615 (1990-01-01), Motta
patent: 5070814 (1991-12-01), Whiffin
patent: 5203925 (1993-04-01), Shibuya
patent: 5252134 (1993-10-01), Stauffer
patent: 5383970 (1995-01-01), Asaba

Affiliated with

Also associated with

Rating

Hydrophobic processing apparatus including a liquid delivery sys does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hydrophobic processing apparatus including a liquid delivery sys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hydrophobic processing apparatus including a liquid delivery sys will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-136036