Hybrid integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

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Details

257678, 257681, 257723, 257724, A01L 2302, A01L 2312

Patent

active

052851079

ABSTRACT:
A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 4727221 (1988-02-01), Saitou et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5016138 (1991-05-01), Woodman

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